The Effect of Cold Rolling Process on the Microstructure and Texture Evolution in a 1 wt. % Si Non-oriented Electrical Steel

Document Type : Research Paper


1 Department of Materials Engineering, Isfahan University of Technology, Isfahan 84156- 83111, Iran

2 Department of Mechanical Engineering, University of Saskatchewan, Saskatoon, SK, Canada S7N 5A9


In this study, the effect of cold rolling process on the microstructure and texture evolution in 1wt. % Si non-oriented electrical steel was investigated. For this purpose, all samples were processed through single-stage hot rolling at 1100 ° C and two-stage cold rolling (cross rolling and unidirectional rolling) with intermediate annealing at 650 °C for 35 seconds. Finally, all of them were fully annealed for 3 min at 900 ° C. The results showed that cold rolling process could affect shear band formation, deformation texture and annealing texture. Shear band and {322} grains were decreased and {100} grains were increased by the cross rolling method. These observations showed the weakening of the {110} and {111} components and the strengthening of the {001} component after final annealing for the cross rolled sample. On the other hand, shear band formation in the unidirectional rolling sample caused the development of annealing Goss texture component ({110} ).


J.T. Park and J.A. Szpunar: Acta Mater., 51 (2003), 3037.
S.S.F. De Dafé, S.D.C. Paolinelli and A.B. Cota: J. Magn. Magn. Mater., 323 (2011), 3234.
S.D.C. Paolinelli, M.A. da Cunha and A.B. Cota: J. Magn. Magn. Mater., 320 (2008), e641.
M. Koizumi and H. Inagaki: Met. Mater., 5 (1999), 511.
A. Sonboli, M.R. Toroghinejad, H. Edris and J.A. Szpunar: J. Magn. Magn. Mater., 385 (2015), 331.
J.Y. Park, K.H. Oh and H.Y. Ra, ISIJ Int., 41 (2001), 70.
Y.Y. Tse, G.L. Liu and B.J. Duggan: Scr. Mater., 42 (1999), 25.
J.-T. Park, J. a. Szpunar and S.Y. Cha: ISIJ Int., 43 (2003), 1611.
F.J. Humphreys and M. Hatherly: Recrystallization and Relted Annealing Phenomena, Elsevier, (2004).
M. Shiozaki and Y. Kurosaki: J. Mater. Eng., 11 (1989), 37.
E. Stephenson and A. Marder: IEEE Trans. Magn., 22 (1986), 101.