Electroless Deposition of Ni-Cu-P Alloy on 304 Stainless Steel by Using Thiourea and Gelatin as Additives and Investigation of Some Properties of Deposits
[1] D. Tachev, J. Georgieva, S. Armyanov,
Electrochimica Acta, 47(2001) ,359.
[2] Z. Bangwei, X. Haowen, Mater. Sci, Eng. A,
281(2000) ,286.
[3] M. Ishikawa, H. Enomoto, N. Mikamoto, T.
Nakamora, M. Matsuoka, C. Iwakura, Sur. Coat.
Tech.110(1998) ,121.
[4] H. A. Sorkhabi, H. Dolati, N. Parvini Ahmadi, J.
Manzoori, App. Sur. Sci., 185(2002), ,155.
[5] R.D. Mikkola, Q.T. Jiang, B. Carpenter, Plat.
Surf. Finish. 87(2000),81.
[6] J. Reid, S. Mayer, E. Broadbent, E. Klawuhu, K.
Ashtiani, Solid State Technoil.(2000) ,86.
[7] K. Lung lin, Y. L C. C. Chan Huang, F. I Li, J. C.
Hsu, App. Sur. Sci. 181(2001) ,166.
[8] J.E.A.M. V. D. Meerakker, J. Appl. Electrochem.
11(1981) ,395.
[9] K. Lung Lin, J. W. Hwang, Mater. Chem. Phy.
76(2002) ,204.
[10] G.O. Mallory, J.B. Hagdu, Electroless plating:
Fundmentals and applications, AESF, Orlando, FL,
(1990) ,118.
Electrochimica Acta, 47(2001) ,359.
[2] Z. Bangwei, X. Haowen, Mater. Sci, Eng. A,
281(2000) ,286.
[3] M. Ishikawa, H. Enomoto, N. Mikamoto, T.
Nakamora, M. Matsuoka, C. Iwakura, Sur. Coat.
Tech.110(1998) ,121.
[4] H. A. Sorkhabi, H. Dolati, N. Parvini Ahmadi, J.
Manzoori, App. Sur. Sci., 185(2002), ,155.
[5] R.D. Mikkola, Q.T. Jiang, B. Carpenter, Plat.
Surf. Finish. 87(2000),81.
[6] J. Reid, S. Mayer, E. Broadbent, E. Klawuhu, K.
Ashtiani, Solid State Technoil.(2000) ,86.
[7] K. Lung lin, Y. L C. C. Chan Huang, F. I Li, J. C.
Hsu, App. Sur. Sci. 181(2001) ,166.
[8] J.E.A.M. V. D. Meerakker, J. Appl. Electrochem.
11(1981) ,395.
[9] K. Lung Lin, J. W. Hwang, Mater. Chem. Phy.
76(2002) ,204.
[10] G.O. Mallory, J.B. Hagdu, Electroless plating:
Fundmentals and applications, AESF, Orlando, FL,
(1990) ,118.
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